Today, in order to offer its customers a comprehensiv variety of solutions in the microelectronic area, Micronor broadens its product range by distributing ceramic packages of different types :
Dual In Line , LCCC ( Leadless Ceramic Chip Carriers), CFP(Ceramic Flat Package ),CQFP ( Ceramic Quad Flat Package ) ,PGA (Pin Grid Array ),Hybrid IC Ceramic .

These packages are manufactured by the Chinese company ZSMP ( Zhongshan Microelectronic ) . ZSMC has had the expertise in manufacturing these products for more than 10 years . The quality of these packages is well known as they are used in a great variety of applications such as military , aerospace, nuclear and industry .
The devices are conform to the norm MIL STD 883 .

A few examples of the non exclusiv range of products :
- LCCC family: 2 types of pitch 1.27 mm and 0.635 mm-their pin number can reach 208 .
- CFP family: pitch 1.27 mm
- CQFP family: pitch 0.635 mm , 132 pins
- PGA family: up to 208 pins

Micronor and can also provide custom solutions in parnership with its new supplier.

About Micronor :
Micronor M7D is a specialist in glass to metal hermetic sealing and brazing, targetting different areas of industry such as medical, télécommunication, petroleum, space, nuclear, aerospace, military.... The company has developped its activities with glass to titanium as well as with the more recent ones in ceramic to metal.